Detailed Description

Very unique solder-bumped 200mm silicon wafer made by Great Wall Semiconductor for the manufacture of high-power FETs is new. This represents one of the latest technologies in semiconductor manufacturing and these new wafers are fascinating to study. Each 200mm dia. wafer is covered with solder bumps. The bumps allow better connection to external leads and better performance. We do not have any further data on these but they are new and each wafer's original cost was hundreds of dollars. You can easily attach components to this wafer with a soldering iron to create unique "Art Objects".